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芯片制造——半导体工艺制程实用教程(第6版) 英文版

芯片制造——半导体工艺制程实用教程(第6版) 英文版

  • 字数: 1026000
  • 装帧: 平装
  • 出版社: 电子工业出版社
  • 作者: (美)彼得·范·赞特 著
  • 出版日期: 2014-11-01
  • 商品条码: 9787121243783
  • 版次: 1
  • 开本: 16开
  • 页数: 546
  • 出版年份: 2014
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内容简介
本书是一本介绍半导体集成电路和器件制造技术的专业书籍,在半导体领域享有很高的声誉。本书的范围包括半导体工艺的每个阶段:从原材料的制备到封装、测试和成品运输,以及传统的和现代的工艺。全书提供了详细的插图和实例,每章包含回顾总结和习题,并辅以丰富的术语表。第六版修订了微芯片制造领域的新进展,讨论了用于图形化、掺杂和薄膜步骤的先进工艺和尖端技术,使隐含在复杂的现代半导体制造材料和工艺中的物理、化学和电子的基础知识更易理解。本书的主要特点是避开了复杂的数学问题介绍工艺技术内容;加入了半导体业界的新成果,可以使读者了解工艺技术发展的趋势。本书可作为高等院校电子科学与技术专业和职业技术培训的教材,也可作为半导体专业人员的参考书。
目录
1 The Semiconductor Industry
Introduction
Birth of an Industry
The Solid-State Era
Integrated Circuits (ICs)
Process and Product Trends
Moore’s Law
Decreasing Feature Size
Increasing Chip and Wafer Size
Reduction in Defect Density
Increase in Interconnection Levels
The Semiconductor Industry Association Roadmap
Chip Cost
Industry Organization
Stages of Manufacturing
Six Decades of Advances in Microchip Fabrication Processes
The Nano Era
Review Topics
References
2 Properties of Semiconductor Materials and Chemicals
Introduction
Atomic Structure
The Bohr Atom
The Periodic Table of the Elements
Electrical Conduction
Conductors
Dielectrics and Capacitors
Resistors
Intrinsic Semiconductors
Doped Semiconductors
Electron and Hole Conduction
Carrier Mobility
Semiconductor Production Materials
Germanium and Silicon
Semiconducting Compounds
Silicon Germanium
Engineered Substrates
Ferroelectric Materials
Diamond Semiconductors
Process Chemicals
Molecules, Compounds, and Mixtures
Ions
States of Matter
Solids, Liquids, and Gases
Plasma State
Properties of Matter
Temperature
Density, Specic Gravity, and Vapor Density
Pressure and Vacuum
Acids, Alkalis, and Solvents
Acids and Alkalis
Solvents
Chemical Purity and Cleanliness
Safety Issues
The Material Safety Data Sheet
Review Topics
References
3 Crystal Growth and Silicon Wafer Preparation
Introduction
Semiconductor Silicon Preparation
Silicon Wafer Preparation Stages
Crystalline Materials
Unit Cells
Poly and Single Crystals
Crystal Orientation
Crystal Growth
Czochralski Method
Liquid-Encapsulated Czochralski
Float Zone
Crystal and Wafer Quality
Point Defects
Dislocations
Growth Defects
Wafer Preparation
End Cropping
Diameter Grinding
Crystal Orientation, Conductivity, and Resistivity Check
Grinding Orientation Indicators
Wafer Slicing
Wafer Marking
Rough Polish
Chemical Mechanical Polishing
Backside Processing
Double-Sided Polishing
Edge Grinding and Polishing
Wafer Evaluation
Oxidation
……
4 Overview of Wafer Fabrication and Packaging
5 Contamination Control
6 Productivity and Process Yields
7 Oxidation
8 The Ten-Step Patterning Process―Surface Preparation to Exposure
9 The Ten-Step Patterning Process―Developing to Final Inspection
10 Next Generation Lithography
11 Doping
12 Layer Deposition
13 Metallization
14 Process and Device Evaluation
15 The Business of Wafer Fabrication
16 Introduction to Devices and Integrated Circuit Formation
17 Process and Device Evaluation
18 Packaging
Glossary
Index

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