Preface About the Authors 1 LEDs for Solid-State Lighting 1.1 Introduction 1.2 Evolution of Light Sources and Lighting Systems 1.3 Historical Development of LEDs 1.4 Implementation of White Light Illumination with an LED 1.5 LEDs for General Lighting References 2 Packaging of LED Chips 2.1 Introduction 2.2 Overall Packaging Process and LED Package Types 2.2.1 PTH LED Component 2.2.2 SMD LED Component 2.3 Chip Mounting and Interconnection 2.3.1 Die Attach Adhesive 2.3.2 Soldering and Eutectic Bonding 2.3.3 Wire Bonding 2.3.4 Flip-Chips 2.4 Phosphor Coating and Dispensing Process 2.4.1 Dispersed Dispensing 2.4.2 Conformal Coating 2.4.3 Remote Phosphor 2.5 Encapsulation and Molding Process 2.5.1 Encapsulant Filling with Lens 2.5.2 Lens Molding 2.6 Secondary Optics and Lens Design References 3 Chip Scale and Wafer Level Packaging of LEDs 3.1 Introduction 3.2 Chip Scale Packaging 3.3 Enabling Technologies for Wafer Level Packaging 3.3.1 Photolithography 3.3.2 Wafer Etching 3.3.3 TSV Filling 3.3.4 Bond Pad Metallization 3.3.5 Wafer Level Phosphor Deposition Methods 3.3.6 Moldless Encapsulation 3.4 Designs and Structures of LED Wafer Level Packaging 3.4.1 Reflective Layer Design 3.4.2 Cavity and Reflective Cup by Wet Etching 3.4.3 Copper-Filled TSVs for Vertical Interconnection and Heat Dissipation 3.5 Processes of LED Wafer Level Packaging 3.5.1 Case 1: Multichip LED WLP with Through Silicon Slots 3.5.2 Case 2: LED WLP with a Cavity 3.5.3 Case 3: Applications of an LED WLP Panel References 4 Board Level Assemblies and LED Modules 4.1 Introduction 4.2 Board Level Assembly Processes 4.2.1 Metal Core Printed Circuit Board 4.2.2 Printed Circuit Board with Thermal Vias 4.2.3 Wave Soldering 4.2.4 Surface Mount Reflow 4.3 Chip-on-Board Assemblies 4.4 LED Modules and Considerations References 5 Optical, Electrical, and Thermal Performance 5.1 Evaluation of Optical Performance 5.1.1 Basic Concepts of Radiometric and Photometric 5.1.2 Irradiance Measurement Calibration 5.1.3 Common Measurement Equipment 5.2 Power Supply and Efficiency 5.2.1 Electrical Characteristics of LED 5.2.2 Power Supply for LEDs 5.2.3 Power Efficiency 5.3 Consideration of LED Thermal Performance 5.3.1 Thermal Characterization Methods for LEDs 5.3.2 Thermal Management Methods References 6 Reliability Engineering for LED Packaging 6.1 Concept of Reliability and Test Methods 6.1.1 Reliability of Electronic Components or Systems 6.1.2 Common Failure Mechanisms and Reliability Tests 6.2 Failure Analysis and Life Assessment 6.2.1 Methodology for Failure Analysis 6.2.2 Weibull Analysis and Acceleration Model for Life Assessment 6.3 Design for Reliability References 7 Emerging Applications of LEDs 7.1 LEDs for Automotive Lighting 7.1.1 Development 7.1.2 Typical Structures 7.1.3 Challenges 7.1.4 Conclusion 7.2 Micro- and Mini-LED Display 7.2.1 Development 7.2.2 Typical Structures 7.2.3 Challenges 7.2.4 Conclusion 7.3 LED for Visible Light Communication 7.3.1 Development 7.3.2 Typical Applications 7.3.3 Challenges 7.3.4 Conclusion References 8 LEDs Beyond Visible Light 8.1 Applications of UV LED 8.1.1 Structures 8.1.2 Applications 8.1.3 Challenges 8.1.4 Conclusion 8.2 Applications of IR-LEDs 8.2.1 Structures 8.2.2 Applications 8.2.3 Challenges 8.2.4 Conclusion 8.3 Future Outlook and Other Technology Trends 8.3.1 Better Light Sources 8.3.2 Interconnection 8.3.3 Interaction with Humans 8.3.4 Light on Demand References Index
