Preface
Acknowledgments
About the authors
1 Introduction
1.1 Evolution of integrated circuit packaging
1.2 Performance and design methodology for integrated circuit packaging
References
Further reading
2 Electrical modeling and design
2.1 Fundamental theory
2.2 Modeling,characterization,and design of through-silicon via packages
References
3 Thermal modeling,analysis,and design
3.1 Principles of thermal analysis and design
3.2 Package-level thermal analysis and design
3.3 Numerical modeling
3.4 Package-level thermal enhancement
3.5 Air cooling for electronic devices with vapor chamber configurations
3.6 Liquid cooling for electronic devices
3.7 Thermoelectric cooling
References
4 Stress and reliability analysis for interconnects
4.1 Fundamental of mechanical properties
4.2 Reliability test and analysis methods
4.3 Case study of design-for-reliability
References
5 Reliability and failure analysis of encapsulated packages
5.1 Typical integrated circuit packaging failure modes
5.2 Heat transfer and moisture diffusion in plastics integrated circuit packages
5.3 Thermal-and moisture-induced stress analysis
5.4 Fracture mechanics analysis in integrated circuits package
5.5 Reliability enhancement in PBGA package
References
Further reading
6 Thermal and mechanical tests for packages and materials
6.1 Package thermal tests
6.2 Material mechanical test and characterization
References
7 System-level modeling,analysis,and design
7.1 System-level thermal modeling and design
7.2 Mechanical modeling and design for microcooler system
7.3 Codesign modeling and analysis for advanced packages
References
Appendix 1 Nomenclature
Appendix 2 Conversion factors
Index
