《陶瓷的表征(英文)》的主要内容包括：preface to the reissue of the materials characterization series xi；preface to series xii；preface to the reissue of characterization of ceramics xiii；preface xiv；contributors xvii等。
作者简介
Ronald E. Loehman，Engineers and scientists who frequently deal with ceramics are unlikely to beaware of the full range of characterization techniques applicable for findingsurface and microanalytical information on their materials. Characterization ofCeramics discusses areas of ceramics where surface and analytical information are important to processing and determination of properties. This uniquereference presents material through case histories to illustrate the applicability of different analytical techniques to ceramics. Different techniques arecompared and contrasted to give the reader sufficient basis for selecting oneover another. Each chapter begins with brief background information on thetopic， followed by a more extensive discussion of applications and benefits ofthe techniques.
目录
Preface to the Reissue of the Materials Characterization Series Preface to Series Preface to the Reissue of Characterization of Ceramics Preface Contributors POWDER AND PRECURSOR PREPARATION BY SOLUTION TECHNIQUES 1.1 Introduction Mixed Oxide Processing Chemical Synthesis of Powders 1.2 Powder Characterization Physical Characteristics Chemical Properties 1.3 Precursor Powder Synthesis Speciation and Supersaturation Growth 10, Nucleation Agglomeration 1.4 Summary POWDER PREPARATION BY GAS-PHASE TECHNIQUES 2.1 Introduction 2.2 Powder Production by Thermal Decomposition Techniques Aerosol Precursor Processes Vapor Precursor Processes 2.3 Powder Production by Plasma Techniques 2.4 Powder Production by Supercritical Fluid Techniques 2.5 Powder Characterization 2.6 Summary FORMATION OF CERAMIC FILMS AND COATINGS 3.1 Introduction 3.2 Film Deposition and Coating Processes Physical Vapor Deposition Chemical Vapor Deposition Solution and Sol-Gel Techniques Thermal Spray Processing Hard Carbon Coatings 3.3 Physical Characterization Density, Porosity and Voids Morphology Thickness Surface Finish 3.4 Chemical Characterization Elemental Analysis Chemical State Analysis Microstructure 3.5 Mechanical Characterization Adhesion Hardness Internal Stress 3.6 Summary CONSOLIDATION OF CERAMIC THICK FILMS 4.1 Introduction 4.2 Thick Film Processing 4.3 Characterization of Ceramic Thick Film Consolidation Characterization of Films Before Thermal Processing Characterization of Thick Films During Thermal Processing Characterization of Sintered Thick Films 4.4 Summary CONSOLIDATION OF BULK CERAMICS 5.1 Introduction 5.2 Ceramic Consolidation Green Body Fabrication Pre-Sinter Thermal Processing Sintering/Thermal Consolidation 5.3 Characterization of Ceramics Characteristics and Characterization of Green Ceramic Compacts Characterization of Pre-Sinter Thermal Processes Characteristics and Characterization of Sintered Ceramics 5.4 Summary …… INORGANIC GLASSES AND GLASS-CERAMICS CERAMIC MICROSTRUCTURES CERAMIC REACTIONS AND PHASE BEHAVIOR MECHANICAL PROPERTIES AND FRACTURE CERAMIC COMPOSITES GLASS AND CERAMIC JOINTS ELECTRONIC AND MAGNETIC CERAMICS NONDESTRUCTIVE EVALUATION APPENDIX: TECHNIQUE SUMMARIES
摘要
Controlling the partial pressure of oxygen over the reacting mixture can also havea profound effect on the rate of reaction in cases where the number of defects andeven the particular phases involved can be changed. The current interest in hightemperature superconductors provides an excellent example. Because the range ofoxygen nonstoichiometry can be relatively large in these materials， the number ofanion vacancies can vary widely. The vacancy content of the product layer， in thisexample， will determine the diffusion rates within the barrier phase and therebycontrol the rate of reaction. The Hedvall effect was mentioned previously as another potential influence onreactivity. Since changes in rate have been noted during magnetic transitions， it mayseem reasonable to conclude that the internal magnetic field set up by the reactantsand products alters the rate of the reaction during that time. That raises the questionof whether or not the imposition of an external magnetic field will affect the courseof a reaction involving magnetic materials. Studies of this topic have——not alwaysagreed—see， for example， Reference 30 and references therein. It is less controversial that an external electrical field will affect reactions， sincethere is frequently a flux of electrons involved in the particular overall reaction. Thenature of the electrical contacts is important in such reactions； for example， is therea dosed—circuit conduction path or is there only a field applied without contacts？Even the provision for a short circuit without the application of an external field willfacilitate many reactions. The buildup of charge barriers at interfaces such as grainboundaries becomes an important consideration in these cases.
