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非晶态和纳米合金的化学镀--制备原理微观结构和理论(英文版)(精)

非晶态和纳米合金的化学镀--制备原理微观结构和理论(英文版)(精)

  • 字数: 1254
  • 出版社: 化学工业
  • 作者: 张邦维
  • 商品条码: 9787122291608
  • 版次: 1
  • 开本: 16开
  • 页数: 749
  • 出版年份: 2017
  • 印次: 1
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内容简介
由张邦维所著的《非晶态和纳米合金的化学镀- -制备原理微观结构和理论(英文版)(精)》一书 全面阐述了非晶态和纳米合金化学镀的制备原理(镀 槽与稳定性,镀速及影响因素)、微观结构、机理、 形成和形成区理论以及微观理论。本书突出原创,集 中阐述了铁基化学镀合金镀层与非晶合金镀层形成和 形成区理论等作者具有自主知识产权的成果,以及纳 米合金化学镀、镀速统一分析、表面形貌及分析、形 成和微观理论等内容,反映了国际化学镀发展的最新 内容。 作者以独特的视角讲述并分析了化学镀70多年来 的发展史。通过发现式写法,在阐述内容的同时,指 出问题和发展方向,引导读者深入思考。 本书可供材料、物理、化学等相关学科科研技术 人员、研究生,对科研和工业关心的公职与公众人士 阅读。
作者简介
张邦维在物理和材料科学领域从事教学和科研愈50年,他的研究集中于纳米和非晶态材料,EP合金镀层,合金热力学和理论,EAM理论与应用,其成果得到国内外学术界的广泛引用和承认。他曾获得过德国马普奖学金,并两次在德国IPP(等离子体物理所)合作研究工作,也曾两次在美国弗吉尼亚大学材料科学工程系合作研究。他和他的研究组在纳米材料领域工作过20多年,专注于纳米材料各种制备方法及其形成理论上。
目录
Preface ⅩⅤ Part Ⅰ History of Electroless Plating 1. History–From the Discovery of Electroless Plating to the Present 1.1 Discovery of Electroless Plating 1.1.1 Early Works 1.1.2 Brenner and Riddell’s Work 1.2 Early Stage of Development (1940s–1959) 1.2.1 Research Works 1.2.2 Patents Issued 1.2.3 Preliminary Applications 1.3 Slow Growth of Period (1960–1979) 1.3.1 Improvement of the Plating Bath 1.3.2 Various Electroless Plating Metals 1.3.3 Electroless Plating Cu 1.3.4 Deposition Substrate 1.3.5 Application 1.4 Rapid Development of Period (1980–1999) 1.4.1 Studying the Nature of Electroless Plating 1.4.2 Studying the Properties of Electroless Plating Deposits 1.4.3 Large-Scale Application in Many Industries 1.4.4 Investigation of Ternary and Multicomponent Alloys and Composites 1.4.5 Electroless Plating Began and Developed Rapidly in China 1.4.6 Electroless Plating Fe–B Based Alloys Have Been Proposed and Developed 1.5 In-Depth Development and Nanoelectroless Plating Stage (2000–Present) 1.5.1 In-Depth Investigation of the Mechanism and Theory in Electroless Plating 1.5.2 Rapid Development of Nanoelectroless Plating 1.6 Summary and Prospect References Part Ⅱ Technology of Electroless Plating-Plating Bath, Critical Parameters, Deposition Rate,and Stability of Plating Bath 2. Electroless Plating Baths of Metals, Binary Alloys,and Multicomponent Alloys 2.1 General Consideration for Electroless Plating Bath Solution 2.2 Plating Bath of Electroless Pure Nickel and Nickel-Based Binary Alloys 2.2.1 Pure Ni and Co Metals 2.2.2 Ni–P 2.2.3 Ni–B 2.3 Cobalt-Based Binary Alloys 2.3.1 Co–P 2.3.2 Co–B 2.4 Cu and Copper-Based Binary Alloys 2.5 Au 2.6 Ag 2.7 Pd and Palladium-Based Binary Alloys 2.8 Pt and Platinum-Based Binary Alloys 2.9 Ru, Rh, Os, and Cr–P Binary Alloys 2.10 Group B Metals (Zn, Cd, In, Sn, Pb, As, Sb, and Bi) and a Few Binary Alloys of these Metals 2.11 Electroless Plating of Ternary Alloys 2.11.1 Ni–Me–P Alloy Plating Baths 2.11.2 Co–Me–P Alloy Plating Baths 2.11.3 Ni–Me–B Alloy Plating Baths 2.11.4 Co–Me–B Alloy Plating Baths 2.11.5 Other Ternary Alloy Plating Baths 2.12 Electroless Plating of Quaternary Alloys 2.12.1 Ni-Based Quaternary Alloy Plating Baths 2.12.2 Co-Based Quaternary Alloy Plating Baths 2.13 Electroless Plating Quinary and Multialloys 2.14 Summary References 3. Electroless Composite Plating 3.1 General Considerations about ECP 3.2 Bath Solutions of ECP 3.2.1 Bath for Binary Alloy-Based ECP 3.2.2 Bath for Ternary Alloy-Based ECP 3.2.3 Bath for ECP With Two Kinds of Particles 3.3 Summary References 4. Nano Electroless Plating 4.1 Bulk Nano EP Materials 4.1.1 Nano ECP 4.1.2 EP Three-Dimensional Nanostructured Materials (3D NSMs) 4.2 2D Nano EP Materials 4.2.1 EP 2D Nano Films 4.2.2 EP 2D Nanoplates 4.2.3 EP 2D Nanodisks 4.2.4 EP 2D Nanoshells and Nanosheets 4.2.5 EP 2D Nanowalls 4.2.6 EP 2D Nano Circles and Rings 4.2.7 EP 2D Nanohoneycomb 4.2.8 EP 2D Nanoline, Nanofi n Pattern, and 2D Nano Grating 4.3 Linear (1D) Nano EP Materials 4.3.1 EP Nanotubes 4.3.2 EP Nanowires 4.3.3 EP Nanorods 4.3.4 EP Nanobelts 4.4 Zero-Dimensional Nano EP Materials 4.4.1 EP Nanoparticles 4.4.2 EP Nanoparticle Arrays 4.4.3 EP Nanoparticles Other Than Spherical Shape 4.4.4 EP Core-Shell Nanoparticles 4.5 Summary References 5. Electroless Plating Fe-Based Alloys 5.1 Why Electroless Plating Fe–B Alloys? 5.2 Discovery of EP Fe–B Alloys 5.2.1 The Plating Bath and Affective Parameters 5.2.2 Analysis of the Diffi culty in Obtaining EP Fe–B Alloys 5.2.3 Composition, Structure, and Properties of EP Fe–B Alloys 5.2.4 Formation Mechanism of EP Fe–B Alloys 5.2.5 Problems and Worthwhile Improvements for EP Fe–B Alloys 5.3 EP Binary Fe–B Alloys 5.4 EP Fe–B-Based Multicomponent Alloys 5.4.1 EP Fe–W–B Alloy Deposits 5.4.2 EP Fe–Mo–B Alloy Deposits 5.4.3 EP Fe–Sn–B Alloy Deposits 5.4.4 EP Fe–W–Mo–B Alloy Deposits 5.4.5 EP Fe–Ni–B Alloy Deposits 5.5 EP Fe–P Alloys 5.6 EP Fe–P-Based Ternary-Component Alloys 5.7 Summary References 6. Impact Parameters and Deposition Rate 6.1 Effects of Plating Bath Components on Deposition Rate 6.1.1 Effect of Metal Salts 6.1.2 Effect of Reducing Agent 6.1.3 The Effect of Complexing Agent 6.1.4 Effect of Stabilizer 6.1.5 Effect of Accelerating Agent 6.1.6 The Effect of Surfactants 6.2 Effects of Operating Conditions 6.2.1 Effect of pH Value 6.2.2 Effect of Plating Temperature 6.2.3 Effect of Plating Time 6.3 Effects of other Technological Parameters 6.3.1 Effect of Stirring 6.3.2 Effect of Magnetic Field 6.3.3 Effect of Bath Loading 6.4 Summary References 7. Green Electroless Plating 7.1 What is Green Electroless Plating? 7.2 Green Electroless Plating of EN 7.3 Green Electroless Plating on Cu 7.3.1 Hypophosphite 7.3.2 Glyoxylic Acid 7.3.3 DMAB 7.3.4 Sodium Bisulfate 7.3.5 Co2+ and Fe2+ 7.3.6 Saccharide 7.3.7 Green Ligand for EP Cu 7.4 Green Electroless Plating Ag 7.5 Green Electroless Plating Au 7.6 Summary References Part Ⅲ Composition, Microscopic Structure,and Surface Morphology of Electroless Deposits 8. Composition and Microstructure 8.1 Composition and Microstructures of EP Alloy Deposits 8.1.1 Ni–P Alloy Deposits 8.1.2 Other EP Binary Deposits 8.1.3 Binary Alloy-Based ECP Deposits 8.2 Composition and Microstructures of EP Ternary and Multicomponent Alloy Deposits 8.2.1 Effects of Metal Salts on Composition and Structure in Ternary and Quaternary Alloy Coatings 8.2.2 Effects of Reductant on Composition and Structure in Ternary and Quaternary Alloy Coatings 8.2.3 Effects of Complexing Agents on Composition and Structure in Ternary and Quaternary Alloy Coatings 8.2.4 Effects of pH Value on Composition and Structure in Ternary and Quaternary Alloy Coatings 8.2.5 Effects of Temperature on Composition and Structure in Ternary and Quaternary Alloy Coatings 8.2.6 Infl uence of Ultrasound on Composition and Structure of EN Deposits 8.3 Crystallization of EP Amorphous Alloys 8.3.1 Crystallization Process and Products of EP Alloys Deposits 8.3.2 Crystallization Temperature and Activation Energy of EP Alloy Deposits 8.3.3 Crystallization Transformation Kinetics of EP Alloy Deposits 8.4 Summary References 9. Surface Morphologies 9.1 Skeleton Understanding of Surface Morphologies of the EP Alloy Coatings 9.1.1 What Magnifi cation Can See the Morphology Clearly? 9.1.2 What Are the Morphological Features for Ni–P Based Alloy Deposits? 9.1.3 What is the Infl uence of Alloying Elements on the Surface Morphology of Ni–P Based Alloy Deposits? 9.1.4 Is there a Quantitative Relationship Between the Particle Size and Alloy Composition? 9.1.5 Should the Surface Morphology of Electroless Amorphous Coatings Be a Distinctive Pattern or Featureless? 9.2 The Effect of Alloying Elements on SEM 9.2.1 The Surface Morphology of EP Pure Metals 9.2.2 The Surface Morphology of EP Binary Alloy Films 9.2.3 The Surface Morphology of EP Multicomponent Alloy Films 9.3 Surface Morphology of ECP Alloy Deposits 9.4 Effects of Various Parameters on SEM 9.4.1 Effects of the Concentration of Metal Salts on SEM 9.4.2 Effects of Reductant on SEM 9.4.3 Effects of Complexing Agents on SEM 9.4.4 Effects of Stabilizers on SEM 9.4.5 Effects of Surfactants on SEM 9.4.6 Effects of pH Values on SEM 9.4.7 Effects of Plating Temperature on SEM 9.4.8 Effects of Plating Time on SEM 9.4.9 The Effects of Heat Treatment on SEM 9.5 Summary References Part Ⅳ Kinetics, Mechanism, and Theory of Electroless Plating 10. Mechanism of Electroless Plating 10.1 The Existing Reaction Mechanism of EP Deposits 10.1.1 The So-Called Four Classical Mechanisms 10.1.2 Mixed Potential Theory 10.1.3 The Uniform Electrochemical Mechanism 10.2 Shortcomings and Defi ciencies of Existing Reaction Mechanisms of EP Deposits 10.3 Kinetics and Recent Progress 10.3.1 Real-Time Monitoring of Initial EP 10.3.2 Microstructure in Initial Stage of EP 10.3.3 Kinetics and Empirical Modeling of EP 10.4 Summary References 11. Formation Theory and Formation Range of Electroless Amorphous Alloys 11.1 General Description of Formation of Electroless Amorphous Alloys 11.2 Formation Theory of Electroless Amorphous Alloys 11.2.1 A Brief Retrospect of the Quantitative Theory of Metallic Glass Formation 11.2.2 Formation Theory of Electroless Amorphous Alloy Systems 11.3 Formation Range of Electroless Amorphous Alloys: Experimental Facts and Theoretical Calculations 11.3.1 Experimental Data of RAF of EP Amorphous Alloys 11.3.2 Theoretical Calculation of RAF of EP Amorphous Alloys 11.4 Summary References 12. Microscopic Theory of Electroless Plating 12.1 Why Use the Microscopic ab initio Theory to Investigate the EP Process? 12.2 Ab initio Computational Methods 12.2.1 Calculation Methods and Program Package 12.2.2 Selection of the Basis Sets 12.2.3 Selection of Oxidation Pathway 12.2.4 Solvation Effect 12.2.5 Catalytic Activity of Metal Surfaces 12.3 Theoretical Results Obtained by Ab Initio Methods 12.3.1 Reaction Mechanisms of EP Processes for Various Reductants 12.3.2 Detailed Investigation of Atomic Interaction Between Reductants and Metal Surfaces 12.3.3 The Role of Stabilizer and Plating Rate in EP 12.4 Summary and Prospective References Index

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